
Security for Digital Transformation
The KSE series is a Security Chip certified by the NIS KCMVP program.
KSE Series
The KSE series runs the KCMVP-certified cryptographic module (CLIB V1.0) as firmware on top of a CC-certified security chip.
Cryptographic keys are stored securely in the Secure Memory inside the security chip. All cryptographic operations are performed internally, ensuring keys are never exposed outside the chip.
KSE300B includes built-in Anti-Tampering functionality to protect core weapons system technology.
*KCMVP - Korea Cryptographic Module Validation Program
*CC - Common Criteria
Architecture Comparison
KSE Security Chip structure vs. standard MCU
Host MCU or CPU
General Architecture
KSE KCMVP Secure IC
Secure Chip Architecture
Supported Cryptographic Algorithms
| Category | Algorithm | Notes |
|---|---|---|
| RNG | CTR_DRBG | |
| Block Cipher | ARIA | Key length: 128,192,256-bit, Modes: ECB, CBC, CTR, GCM |
| Hash | SHA | SHA-256 |
| MAC | HMAC | Hash: SHA-256 |
| Digital Signature | ECDSA | Curve: P-256 |
| Key Agreement | ECDH | Curve: P-256 |
*AES, DES, T-DES supported
Product Lineup
KSE100B
- CPU
- 16bit RISC
- Memory
- RAM 6KB, Flash 200KB
- Interface
- ISO-7816
- Package
- SOP-8, 5mm x 6mm x 1.6mm
- Operating Voltage
- 1.62V ~ 5.5V
- Certification
- KCMVP (CM-144-2023.10), CC
KSE300B

- CPU
- 32bit RISC
- Memory
- RAM 48KB, Flash 2000KB
- Interface
- SPI
- Package
- QFN-16, 4mm x 4mm x 0.8mm
- Operating Voltage
- 1.62V ~ 5.5V
- Certification
- KCMVP (CM-144-2023.10), CC
KSE300U
- CPU
- 32bit RISC
- Supported OS
- Windows10, Linux
- Interface
- USB (Full Speed)
- Package
- 61mm x 22mm x 9mm
- Operating Voltage
- 5.0V (USB Power)
- Certification
- KCMVP (CM-144-2023.10), CC
Key Features
Application Layer
Chip OS Layer
Hardware Layer
Cryptographic keys stored securely
Secure Key Storage
Cryptographic keys and sensitive data are stored securely in the protected memory inside the CC-certified security chip. Defense mechanisms against physical and side-channel attacks are implemented. NIS KCMVP Physical Security Level 2 achieved (highest domestic rating).
300B
Miniaturization
KSE300B: 4mm x 4mm x 0.8mm, 0.3g. Ideal for compact and lightweight equipment designs.
Application Layer
Chip OS Layer
Hardware Layer
User applications can be implemented in Application Layer
Versatile Applications
User applications can be implemented in the Application Layer. TLS/DTLS, certificate management, and Secure Boot are available.



